Copper plating
Unparalleled Filling Capacity in Pits or Grooves
It includes cyanide copper, acid copper, and a specialized copper electroplating process with high throwing power and unparalleled filling capacity, specifically designed for electroplating printed circuit boards (PCBs). These coatings are used as a nickel underlayer in plastic electroplating and die-cast alloys. Pulse plating processes for copper electroplating are also available.
CUPRUM 10 Cyanide Copper Plating Process
CUPRUM 10 is a cyanide bath known for its high speed, depositing bright, smooth, fine-grained copper layers that are completely soft.
SLOTOCUP TB 50 Acid Copper Plating Process
SLOTOCUP TB 50 is a bright copper plating process based on sulfuric acid. It produces an exceptionally bright finish with high throwing power and excellent uniformity. The deposit is soft, low in internal stress, and exhibits good corrosion resistance.
SLOTOCUP CU 50 PCB Copper Plating Process
SLOTOCUP CU 50 is used for copper plating on printed circuit boards (PCBs), especially in direct metallization processes. This process provides rapid coverage in the lower parts of holes with excellent throwing power. It also offers excellent thickness distribution and metal distribution. The resulting copper deposit is fine-grained, semi-bright, and flexible.
AGG 8 Acid Copper Plating Process
The ACG 8 bright copper plating process is a single-component, acidic solution, making it very easy to work with. It produces a bright and uniform copper coating with high deposition speed. The copper deposits have low internal stress, are flexible, and soft, making them easy to post-process. Steel parts that have been properly mechanically polished can be directly plated with nickel and chromium after copper plating with this method, without any intermediate polishing operations. It’s worth mentioning that the ACG 8 process is insensitive to impurities and is suitable for thick copper deposition for electrical shaping. Additionally, various types of pulse plating processes for copper are available. Copper Plating Process with Pulse Current: There are various types of copper plating processes with pulse current available. These processes are primarily used for plating printed circuit boards (PCBs).
Hard Copper Additive
For creating hard copper coatings (Hard Copper) used in the plating industry for printing rollers and steel shafts, a hardening additive is available to increase hardness and resistance to wear.
Bright Cyanide Copper Single Component
Available now in both sodium and potassium base solutions, this bath provides a smooth and bright copper coating. It is very easy to work with.
High-Speed Acidic and Cyanide Copper Plating Additive (Reel to Reel):
For copper plating, additives are available for both cyanide and acidic solutions designed specifically for high-speed copper deposition in continuous reel-to-reel plating lines. These additives are used for plating wires, tubes, and metal sheets.